SEOUL, South Korea / RankWire.AI / – Samsung Electronics has introduced new strategies for memory and storage technology aimed at enhancing artificial intelligence infrastructure. The company announced these initiatives at the 2026 OCP Global Summit in San Jose, California, which took place from October 12 to 15. Its roadmap emphasizes high-performance memory, expanding memory via Compute Express Link, and next-generation solid-state drives. Additionally, Samsung will collaborate with AMD on a joint CXL demonstration. These plans are designed to address the capacity limitations faced by current AI servers.
Samsung outlined its approach through three primary objectives: increasing speed, enabling memory scalability, and ensuring data persistence. To boost speed, the company showcased customized high-bandwidth memory alongside the eighth-generation HBM5. For scalability, Samsung promoted CXL as a solution to extend capacity beyond what traditional memory modules inside each server can provide. Regarding data persistence, the company introduced advanced SSD-based storage and management technologies. It also presented storage software designed to improve data processing efficiency in AI systems.
According to Samsung, the increasing deployment of AI agents is fueling the need for more memory during inference. Larger models produce greater amounts of data while responding, and this data must remain accessible to processors. Conventional systems restrict the amount of memory each processor can access. Samsung highlighted CXL technology as a practical method to surpass these limitations. The company also demonstrated key-value cache optimization, enabling AI models to reuse previously processed data instead of performing redundant computations.
Partnership with AMD Extends to CXL Memory Expansion
Samsung and AMD will jointly demonstrate a CXL-based solution that increases memory capacity in AI systems. This technology allows processors to share memory resources rather than relying solely on local server memory. Samsung reports that engineers have validated this solution within real system environments. The demonstration builds upon a memorandum of understanding signed in March 2026 between the two companies concerning next-generation AI memory and computing. On October 7, AMD CEO Lisa Su visited Korea and met Jeon Young-hyun, Vice Chairman of Samsung’s Device Solutions division.
Memory pooling was another key element showcased by Samsung. The company demonstrated CMM-D, a CXL-based DRAM module that links multiple memory units into a shared pool. Systems can allocate capacity from this pool based on workload demands. Additionally, Samsung displayed processing-in-memory technology, which performs certain calculations within memory chips to reduce data movement and lower energy consumption. Exhibits included 2-nanometer gate-all-around wafers, Groq LPU wafers, and Nvidia’s Groq 3 LPX system.
Early Co-Design Influences Samsung’s AI Memory Strategy
Shim Ho-jun, Corporate Vice President and Head of Samsung’s Application Engineering Team, shared details of the company’s plans during an executive session. He emphasized that the growth of larger AI models and increased inference demands necessitate greater memory capacity and bandwidth to optimize system performance. Shim also noted Samsung’s efforts to expand co-design and technical validation collaborations with global partners from the earliest stages of development. The goal is to align their memory and storage offerings more precisely with customer system designs.
Samsung MAX Lab provides a dedicated space for clients to evaluate memory and storage solutions under real-world AI workloads. The lab also facilitates co-design services tailored to specific system configurations. Customers can test pre-commercial technologies, including PIM and next-generation SSDs, before they reach the market. Samsung participated in the summit as a Diamond Sponsor. This event follows its 2026 appearances at Nvidia GTC, COMPUTEX, and the Future of Memory and Storage conference, highlighting the company’s expanding focus on AI memory advancements.